Solder paste is a mixture of flux and powdered solder. The process of attaching electrical components to the contact pads is called reflow soldering. During this process, the controlled heat within SMT reflow soldering oven melts the solder, to connect the joints permanently. Special models are designed to meet high thermal requirements and fine mesh belts for miniature parts.
These devices are designed to provide maximum thermal performance with significantly reduced costs and less space needed. Thanks to the fact everything is computer controlled, there is no possibility for causing thermal damages to especially sensitive components, in any stage. Every device has four or more zones, individually controlled, and larger ones up to ten stages.
The preheat stage is necessary to activate the soldering paste. When it starts to evaporate, it starts to make the connections in the next heating zone. The third stage is the place when the joints are exposed to the highest temperature. This temperature has to be calculated to avoid damaging the most sensitive electrical components.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
SMT reflow ovens are mostly categorized in mid to high volume devices, bench top models and nitrogen ovens. They are all designed to provide at least the same performance level compared to standard devices used for this purpose, but they do take up less space and provide very good performance.
Medium to high volume ovens mostly have at least four independent reflow zones, with at least three thermocouple inputs, to ensure the best performance and the best heat control. They are equipped with wide LCD screens, and stainless steel mesh conveyors. They can accept wide boards, and provide very good handling flexibility. Smaller models are very good for testing purposes.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
Easy adjustable thermal management and other advanced functions make these devices easy to handle and safe to use. The system includes different alarms, and can be programmed to start up and shut down automatically. The combination of high efficiency, compact size and energy savings makes these models very convenient for all types of industries and for numerous other purposes.
Of course, for more advanced manufacturing processes there are some models designed with more heating zones and even more sophisticated controls. Large, ten controlled heating zone SMT oven is designed to meet large manufacturers needs. Equipped with high precision conveyor mechanism and some other innovative solutions, these devices take up small space, but provide excellent results with low energy consumption.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
These devices are designed to provide maximum thermal performance with significantly reduced costs and less space needed. Thanks to the fact everything is computer controlled, there is no possibility for causing thermal damages to especially sensitive components, in any stage. Every device has four or more zones, individually controlled, and larger ones up to ten stages.
The preheat stage is necessary to activate the soldering paste. When it starts to evaporate, it starts to make the connections in the next heating zone. The third stage is the place when the joints are exposed to the highest temperature. This temperature has to be calculated to avoid damaging the most sensitive electrical components.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
SMT reflow ovens are mostly categorized in mid to high volume devices, bench top models and nitrogen ovens. They are all designed to provide at least the same performance level compared to standard devices used for this purpose, but they do take up less space and provide very good performance.
Medium to high volume ovens mostly have at least four independent reflow zones, with at least three thermocouple inputs, to ensure the best performance and the best heat control. They are equipped with wide LCD screens, and stainless steel mesh conveyors. They can accept wide boards, and provide very good handling flexibility. Smaller models are very good for testing purposes.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
Easy adjustable thermal management and other advanced functions make these devices easy to handle and safe to use. The system includes different alarms, and can be programmed to start up and shut down automatically. The combination of high efficiency, compact size and energy savings makes these models very convenient for all types of industries and for numerous other purposes.
Of course, for more advanced manufacturing processes there are some models designed with more heating zones and even more sophisticated controls. Large, ten controlled heating zone SMT oven is designed to meet large manufacturers needs. Equipped with high precision conveyor mechanism and some other innovative solutions, these devices take up small space, but provide excellent results with low energy consumption.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
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