In the assembly industries, the process of attaching electronic components on to a printed circuit board (PCB) is usually done by soldering them onto the board. Reflow soldering oven is one of the most modern devices used for to achieve this attachment. The process starts with a sticky mixture of flux and powdered solder that helps to attach the components on to their correct positions on to the board. A process of controlled heating and cooling then follows to achieve permanent joints.
The oven should be able to heat the adjoining surface melting all the solder into their correct positions without overheating or damaging the electrical components. One or more ceramic infrared heater are used as the source of heat that is then directed to heat the assemblies through radiation process although some ovens(Infrared types) uses fans to direct heat to the assemblies.
A basic reflow oven has four stages through which the operation goes to be complete. The starting point is the preheat zone. This is where the temperature/time rate (ramp rate) is determined. It is the rate at which the temperature of the mounting board and the electrical components on it changes relative to time. This is significant as it helps determine the maximum temperatures possible that can be reached and for how long. The solvent in the mix also starts evaporating at this point.
The second phase is the thermal soak zone where the solder paste volatiles are removed. It also involves flux activation(removal of oxide from leads and pads) and the temperatures can range anywhere between 60 to 120 depending on the tolerance levels of mounting board and the components on it.
The reflow zone is the third place where the temperatures reaches maximum peak, usually above the liquidus point. The soldering paste is molten under efficiently controlled conditions reducing the surface tension of flux at the point of metal juncture. The result of this process is the permanent fixing of electrical components on to the circuit board. The ramp rate and temperature control is highly significant at this phase. The sudden change of temperatures from the soak zone to above liquidus can easily destroy the devices through temperature shock and thus calls for very efficient control mechanisms.
Cooling takes place in the last phase also known as the cooling zone from where the molten solder solidifies into the precise target points permanently fixing the electronic components on to the PCB. The temperature control is still significant as such problems like thermal shock or the excessive metallic formation must be avoided I order to obtain a mechanically sound devices attached with fine grained structured solder.
The modern high tech ovens allows for only one reflow at the third phase as the granules in the paste are made to surpass the temperatures at this phase. For optimality and lower consumption therefore, it is advisable to shop for an efficient oven that put in place the most recent technological advancement.
The changing customer needs, competition, market condition and the general technology all calls for adopting measures that optimizes operating efficiency in terms of yield and profitability. It is such measures that can ensure the survival of a firm into the future. For assembly firms in particular, an efficient and modern reflow soldering oven is more than necessary as it increases the production rate and minimizes on power consumption.
The oven should be able to heat the adjoining surface melting all the solder into their correct positions without overheating or damaging the electrical components. One or more ceramic infrared heater are used as the source of heat that is then directed to heat the assemblies through radiation process although some ovens(Infrared types) uses fans to direct heat to the assemblies.
A basic reflow oven has four stages through which the operation goes to be complete. The starting point is the preheat zone. This is where the temperature/time rate (ramp rate) is determined. It is the rate at which the temperature of the mounting board and the electrical components on it changes relative to time. This is significant as it helps determine the maximum temperatures possible that can be reached and for how long. The solvent in the mix also starts evaporating at this point.
The second phase is the thermal soak zone where the solder paste volatiles are removed. It also involves flux activation(removal of oxide from leads and pads) and the temperatures can range anywhere between 60 to 120 depending on the tolerance levels of mounting board and the components on it.
The reflow zone is the third place where the temperatures reaches maximum peak, usually above the liquidus point. The soldering paste is molten under efficiently controlled conditions reducing the surface tension of flux at the point of metal juncture. The result of this process is the permanent fixing of electrical components on to the circuit board. The ramp rate and temperature control is highly significant at this phase. The sudden change of temperatures from the soak zone to above liquidus can easily destroy the devices through temperature shock and thus calls for very efficient control mechanisms.
Cooling takes place in the last phase also known as the cooling zone from where the molten solder solidifies into the precise target points permanently fixing the electronic components on to the PCB. The temperature control is still significant as such problems like thermal shock or the excessive metallic formation must be avoided I order to obtain a mechanically sound devices attached with fine grained structured solder.
The modern high tech ovens allows for only one reflow at the third phase as the granules in the paste are made to surpass the temperatures at this phase. For optimality and lower consumption therefore, it is advisable to shop for an efficient oven that put in place the most recent technological advancement.
The changing customer needs, competition, market condition and the general technology all calls for adopting measures that optimizes operating efficiency in terms of yield and profitability. It is such measures that can ensure the survival of a firm into the future. For assembly firms in particular, an efficient and modern reflow soldering oven is more than necessary as it increases the production rate and minimizes on power consumption.
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